Aluminum nitride

Aluminum nitride (AlN) is a high-performance advanced ceramic material renowned for its exceptional thermal conductivity, outstanding electrical insulation, and excellent mechanical strength. The chemical formula for aluminum nitride is AlN, consisting of aluminum and nitrogen atoms bonded in a hexagonal crystal structure.
Unlike many ceramics, aluminum nitride ceramics combine high thermal conductivity with low dielectric constant, making them an ideal choice for applications where both efficient heat dissipation and electrical insulation are required.
With properties that surpass traditional ceramics like alumina in specific areas, AlN aluminum nitride has become an indispensable material in the semiconductor, electronics, aerospace, and power device industries.

Key Advantages of Aluminum Nitride

Aluminum nitride ceramic stands out due to a combination of superior physical and chemical characteristics that make it a better choice than many traditional materials.

The most significant advantage of AlN is its high aluminum nitride thermal conductivity, which typically ranges from 170 to 200 W/mK and can be even higher. This places it in a league with metals like copper, a stark contrast to traditional ceramics like alumina. This high thermal conductivity of aluminum nitride allows for the rapid and efficient dissipation of heat away from sensitive electronic components, preventing overheating and ensuring device longevity.

AlN is an outstanding electrical insulator with a high dielectric strength and a low dielectric constant. The dielectric constant of aluminum nitride is typically around 8.8. This low dielectric loss makes it an ideal material for high-frequency applications where signal integrity is crucial.

AlN’s CTE is very similar to that of silicon (Si). This property is critical for semiconductor packaging, as it minimizes thermal stress and strain between the chip and the substrate during temperature fluctuations, thereby enhancing the reliability of the entire package.

Aluminum nitride ceramic possesses high flexural strength and hardness, enabling it to withstand significant mechanical stress. This makes it suitable for use in structural components that require both thermal and mechanical robustness.

It exhibits strong resistance to corrosion from molten metals, various semiconductor processing gases, and a wide range of chemicals, ensuring stability in harsh environments.

Unlike beryllium oxide (BeO), another ceramic with high thermal conductivity, aluminum nitride is non-toxic, making it safer to manufacture and handle.

Precautions

Aluminum nitride ceramics react chemically with liquids such as inorganic acids, strong bases, and water and dissolve slowly, so they cannot be directly immersed in such materials. However, aluminum nitride is resistant to most molten salts, including chlorides and cryolite.

Aluminum nitride Ceramic Applications

Aluminum nitride (AlN) ceramics are widely used across multiple high-tech industries due to their excellent thermal conductivity and electrical insulation properties. They are extensively used in semiconductor and electronic packaging, serving as heat dissipation substrates for high-power devices such as IGBT modules and LEDs, ensuring stable operation. In automotive electronics, AlN is a key heat dissipation material for electric vehicle power modules and battery management systems. Furthermore, AlN plays an important role in microwave and radio frequency equipment, medical devices, and aerospace and defense, providing high-performance heat dissipation and electrical insulation solutions.

Applications of Advanced Ceramics in the Automotive
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Applications of Advanced Ceramics in the Semiconductor & Electronic
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Available grades of aluminum nitride material

At Great Ceramic, we offer AlN aluminum nitride ceramics in multiple grades to meet diverse engineering requirements:

Key Properties of Aluminum Nitride

Property AlN-170 (Standard) AlN-200 (Upgraded) AlN-230 (Ultra)
Thermal Conductivity (W/m·K) ≥170 ≥200 ≥230
Volume Resistivity (Ω·cm) >1×1014 >1×1014 >1×1014
Dielectric Strength (kV/mm) >15 >15 >15
Coefficient of Thermal Expansion (CTE) (×10⁻⁶/K) ~4.5 ~4.5 ~4.5
Flexural Strength (MPa) 300 – 400 350 – 450 350 – 450
Maximum Operating Temperature (°C, in inert atmosphere) ≥1000 ≥1000 ≥1000
Oxygen Content (wt%) 0.5 – 1.0 ≤0.5 ≤0.3
Cost Positioning Economy High Performance Ultra-High Performance
Typical Applications General power electronics packaging, LED heat sink substrates High-power semiconductor modules, RF/microwave devices Ultra-high power SiC/GaN modules, high-power lasers, military-grade thermal management

*The values are typical material properties and may vary according to products configuration and manufacturing process. For more details, Please feel free to contact us.

*Aluminum nitride is easy to be oxidized on the surface, which forms a layer of alumina.This helps to protect the material, but it affects the thermal conductivity (alumina is about 30 W/mK).In an oxidative atmosphere, this occurs at about 700℃.In an inert atmosphere, the layer protects AlN at temperatures as high as about 1350℃.When the temperature is higher than this, bulk oxidation occurs.

Aluminum nitride product application cases

Aluminum nitride ceramics combine high thermal conductivity, excellent electrical insulation, low dielectric constant, and a thermal expansion coefficient close to that of silicon, making them versatile materials suitable for numerous industrial applications. The following are the most common and influential use cases of aluminum nitride products in various fields:

  • Aluminum nitride substrates
  • Electronic packaging substrates
  • Heatsinks and thermal spreaders
  • Semiconductor device parts
  • Insulators and carriers
  • Thermal management components
  • Ceramic crucibles
  • Ceramic tubes, rods, and rings
  • Custom precision parts
Aluminum nitride ceramic substrate
Aluminum nitride ceramic washers
Aluminum nitride substrate laser cutting
Alumina ceramic plunger
Aluminum nitride ceramic tube
Aluminum nitride ceramic spacer
Surface metallized ceramic
Aluminum nitride ceramic circuit board

Machining of Aluminum Nitride

Great Ceramic offers AlN aluminum nitride ceramics with high purity and exceptional thermal conductivity aluminum nitride performance, making them ideal for applications that demand both superior heat dissipation and electrical insulation. Aluminum nitride can be formed through several methods, including dry pressing, isostatic pressing, injection molding, and tape casting, depending on the required product geometry and performance.

Sintering is a critical step in aluminum nitride ceramic production. High-temperature sintering in a nitrogen atmosphere ensures densification while preserving the material’s thermal and electrical properties. Similar to alumina ceramics, AlN aluminum nitride shrinks by about 20% during sintering, which makes achieving precise dimensions in the green state challenging. As a result, post-sintering precision machining is necessary to meet exact tolerances and complex geometries.

Due to its high hardness and brittleness, aluminum nitride requires specialized techniques such as diamond grinding, laser machining, or ultrasonic processing. Great Ceramic uses advanced CNC ceramic machining systems to produce intricate parts, from aluminum nitride substrates to complex custom components.

With a full suite of advanced processing equipment and extensive technical expertise, Great Ceramic provides end-to-end solutions — from material selection and design optimization to precision machining and assembly — ensuring high-quality, high-performance aluminum nitride ceramic products for the most demanding applications.

Precision Ceramic CNC Machining

CNC milling, turning, and grinding to micron-level tolerances.

Ceramic Grinding & Polishing

Surface polishing for smooth finishes and optical-grade surfaces.

Technical Ceramic Laser Cutting

Laser drilling and cutting for complex geometries.

Ceramic and Metal Brazed Assemblies

Metallization (Mo/Mn, W) for ceramic-to-metal brazing.

Frequently Asked Questions

Aluminum nitride (AlN) is a ceramic compound (chemical formula for aluminum nitride: AlN) with high thermal conductivity and electrical insulation used in electronic substrates and thermal management.

Yes — AlN is a technical ceramic (an inorganic, nonmetallic, heat-resistant material) widely classified as a ceramic for electronic and thermal applications.

Aluminum nitride has mixed bonding character: predominantly covalent with some ionic contribution — this hybrid bonding helps produce its high thermal conductivity and insulating electrical behavior.

Primary uses: AlN aluminum nitride substrates, heat spreaders/heat sinks, semiconductor fixtures, RF components and any application requiring high thermal conductivity paired with electrical insulation.

In AlN, nitrogen typically has oxidation state of −3 (Al is +3, N is −3), consistent with the Al³⁺/N³⁻ formal view of the compound.

See the “Machining & Processing” section above for machining. Manufacturing (how to make aluminum nitride) is typically via controlled nitridation or carbothermal methods followed by sintering; production requires industrial furnaces and controlled atmospheres — contact our engineering team for custom process advice.

Advanced Ceramics Manufacturing Expert

Why Choose Great Ceramic for Aluminum Nitride

  • We have extensive experience in precision manufacturing aluminum nitride substrates, parts, and custom designs.
  • Our technical team will assist you in optimizing the functionality and manufacturability of your part design.
  • We can customize materials and shapes to meet specific application requirements.
  • We provide fast, high-quality service to customers in North America, Europe, and Asia.

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