Ceramic laser cutting uses high-energy-density laser beams to irradiate ceramic materials, causing the ceramic materials to quickly melt, vaporize or evaporate in a very short period of time, thereby achieving the cutting of ceramic materials. It has the advantages of good cutting quality, high cutting efficiency, small heat-affected zone, suitable for processing complex graphics and curves, and can achieve mass production.

The principle of ceramic laser cutting is to utilize the interaction between the laser beam and the ceramic material. When the laser beam irradiates the surface of the ceramic material, a high-temperature, high-pressure melting zone will be formed on the surface of the ceramic material. Due to the high energy density of the laser beam, the melted zone evaporates rapidly in a very short time, thereby achieving cutting of ceramic materials.

Ceramic laser cutting can process complex patterns, penetrating grooves and holes, and pre-processed dividing lines for breaking off on ceramic substrates. Moreover, we can provide customized processing services according to customers’ technical requirements and drawings.

1. Max Processing Range: 250×250mm
2. Max Processing Thickness: 2.0 (AL₂O₃), 3.0 (ALN), 1.0 (ZrO2),
3. Min Aperture: 0.02mm
4. Min Distance Between Hole And Edge: 0.2mm

The table below is for reference only. Usually, we will make products according to the drawings provided by customers.