Taglio laser ceramico tecnico
Ceramic laser cutting uses high-energy-density laser beams to irradiate ceramic materials, causing the ceramic materials to quickly melt, vaporize or evaporate in a very short period of time, thereby achieving the cutting of ceramic materials. It has the advantages of good cutting quality, high cutting efficiency, small heat-affected zone, suitable for processing complex graphics and curves, and can achieve mass production.
Ceramic Laser Cutting Principle
The principle of ceramic laser cutting is to utilize the interaction between the laser beam and the ceramic material. When the laser beam irradiates the surface of the ceramic material, a high-temperature, high-pressure melting zone will be formed on the surface of the ceramic material. Due to the high energy density of the laser beam, the melted zone evaporates rapidly in a very short time, thereby achieving cutting of ceramic materials.
Ceramic Laser Cutting Customization
Ceramic laser cutting can process complex patterns, penetrating grooves and holes, and pre-processed dividing lines for breaking off on ceramic substrates. Moreover, we can provide customized processing services according to customers’ technical requirements and drawings.
Aluminum Nitride Substrate Laser Cutting
Alumina Substrate Laser Cutting
Alumina Substrate Laser Cutting Grooves
Laser Cutting Insulating Gasket
Beryllium Oxide Laser Cutting
AlN Insulating Gasket
Ceramic Laser Processing Capability
- Max Processing Range: 250×250mm
- Max Processing Thickness: 2.0 (AL2O3), 3.0 (ALN), 1.0 (ZrO2),
- Min Aperture: 0.02mm
- Min Distance Between Hole And Edge: 0.2mm
Laser Cutting Tolerance Reference List
The table below is for reference only. Usually, we will make products according to the drawings provided by customers.
| Articoli | Taglio laser della ceramica | ||
| Generale | Precision | ||
| Length Tolerances | T≤0.645 | +0.20/-0.05 | +0.15/-0.05 |
| 0.635＜T≤1.0 | +0.25/-0.10 | +0.20/-0.05 | |
| 1.0＜T≤1.2 | +0.30/-0.10 | +0.25/-0.10 | |
| Thickness Tolerances | ±10% Min:±0.05 | ±7% Min:±0.05 | |
| Distance Tolerances Between Snap-lines Or Holes | ±0.05 | ±0.05 | |
| Hole Diameter Tolerances | T≤0.645 | ±0.075 | ±0.05 |
| T＞0.635 | ±0.1 | ±0.075 | |
| Tolerance Of Distance From Edge To Snap-line Or Hole | T≤0.645 | +0.15/-0.05 | +0.15/-0.05 |
| 0.635＜T≤1.0 | +0.20/-0.05 | +0.20/-0.05 | |
| 1.0＜T≤1.2 | +0.25/-0.10 | +0.25/-0.10 | |
| Overall Camber | 0.3% Min:0.05 | 0.25% Min:0.05 | |
| Parallelismo/Verticalità | 0,3% dimensione del bordo più lungo | 0,2% dimensione del bordo più lungo | |
Contattaci
Informazioni sulla metallizzazione dei substrati ceramici
