Aluminum Nitride (AlN) Substrate

Aluminum nitride ceramic substrates have high thermal conductivity, low dielectric coefficient and dielectric loss, and excellent mechanical properties, making them one of the most ideal choices for electronic applications. It is widely used in information communications, LED packaging, semiconductors, power modules (IGBT), image sensing, new energy, electronic appliances and other fields.

ALN Substrate Manufacturing Company

Great Ceramic offers aluminum nitride ceramic substrates produced by tape casting. The shape and size can be customized according to customer needs, the surface can also be polished, or various shapes can be customized through laser cutting and other processes, and are suitable for various metallization processes.

Aluminum-nitride-ceramic-substrate

Properties of AlN Ceramic Substrate

Basic properties of ceramic substrates

Items Unit AlN-170 AlN-200 AlN-230
Color – Gray/Beige Gray/Beige Gray/Beige
Volume density g/cm³ 3.3 3.3 3.3
Surface roughness um(Ra) ＜0.8 ＜0.8 ＜0.8
Camber length ‰ ≤3 ≤3 ≤3

Mechanical properties of substrate

Items Unit AlN-170 AlN-200 AlN-230
Bending Strength MPa ≥400 ≥350 ≥300
Fracture Toughness MPa·m1/2 3.0 2.6 2.4
Vickers Hardness GPa 11 11 11

Thermal properties of the substrate

Items Unit AlN-170 AlN-200 AlN-230
Thermal conductivity W/m·k(25℃) ≥170 ≥195 ≥225
Thermal expansion coefficient ×10-6/k (20℃~800℃) 4~6 4~6 4~6
Thermal shock resistance ≥10(800℃) No cracks No cracks No cracks
Heat capacity J/(kg·k) 720 720 720

Electrical properties of the substrate

Items Unit AlN-170 AlN-200 AlN-230
Volume resistance Ω·cm(20℃) ≥1014 ≥1013 ≥1013
Dielectric constant 1MHz 9.0 8.7 8.5
Dielectric loss 1MHz 4×10-4 4×10-4 4×10-4
Dielectric strength KV/mm ≥15 ≥15 ≥15

Note: Each batch may be different, for reference only.

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Aluminum nitride substrate manufacturing workshop

Dimensions Of Ceramic Substrate

Great Ceramic offers a variety of standardized sizes of aluminum nitride (AlN) ceramic to meet customer needs. In addition, we also provide customers with customized services for ceramic substrates, and the size of the substrate can be customized according to customer needs.

Size(mm)
Thickness 50.8×50.8 114.3×114.3 120×120 140×190 254×254 300×300
0.25 √ √ √ – – –
0.38 √ √ √ – – –
0.5 √ √ √ √ – –
0.635 √ √ √ √ √ √
1 √ √ √ √ √ √
1.5 √ √ √ √ √ √
2 √ √ √ √ √ √

Advantages of aluminum nitride ceramic substrates

  1. Conduct strict quality control from raw materials to finished products to ensure uniform quality;
  2. Provide customized processing services, including size adjustment, surface polishing, laser cutting, etc. according to needs;
  3. Widely used in ceramic metallization, such as DPC (direct copper plating method), thin film sputtering method, DBC (direct copper plating method), AMB (active copper brazing method), thick film printing, etc.;
  4. The minimum thickness can reach 0.1 mm.

Conclusion

Aluminum nitride (AlN) ceramic substrates are vital components in modern electronics, offering a unique combination of high thermal conductivity and electrical insulation. Whether you’re looking for an aluminum nitride sheet, substrate, or ceramic material, AlN’s properties make it a top choice for advanced electronic applications.

For more information about our aluminum nitride (AlN) products, including specifications and customization options, please contact us.

Other FAQs:

Aluminum Nitride (AlN) is a nitride of aluminum that exhibits outstanding thermal conductivity and electrical insulation. AlN ceramic is widely used in electronic components where efficient heat dissipation is crucial. Its chemical formula is AlN, and it belongs to the group of III-V nitrides.

The thermal conductivity of aluminum nitride (AlN) is one of its most notable properties, reaching values up to 170-200 W/m·K. This high thermal conductivity makes it an ideal material for substrates in power electronics, where effective heat dissipation is essential for performance and longevity.

Aluminum nitride ceramics are known for their high thermal stability and excellent mechanical properties. AlN ceramic substrates are widely used in semiconductor packaging, LEDs, and microwave devices due to their thermal performance and reliability.

  • Aluminum Nitride Substrate: These substrates are used to support and interconnect electronic components, ensuring that heat is effectively managed and that the device performs optimally.
  • AlN Substrate Applications: AlN substrates are used in various applications, such as power modules, RF components, and sensors, where high thermal conductivity is a priority.

AlN stands for Aluminum Nitride, a material that combines the properties of nitride and aluminum to offer superior thermal management solutions. Nitride aluminum, another term for AlN, highlights the combination of aluminum with nitrogen to produce a ceramic material with unique characteristics, including thermal and electrical performance.

Aluminum nitride sheets are available in various thicknesses and are often used in applications requiring precise thermal management. The aluminum nitride ceramic substrate is a popular choice in electronics due to its excellent thermal conductivity and mechanical properties.

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