Thermal Conductivity of Advanced Ceramics

Thermal conductivity (k, in W/m·K) measures a material’s ability to conduct heat — a critical property for electronics, aerospace, energy, and industrial applications. In this article, we’ll explore how advanced ceramics compare to metals and plastics, why they’re important, and where they’re used.

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Hardness of Ceramics: Properties, Comparison & Applications

Why Ceramic Thermal Conductivity Matters

Ceramics are widely used for thermal management because they uniquely combine high thermal conductivity with excellent electrical insulation. Unlike metals that conduct both heat and electricity, advanced ceramics like aluminum nitride (AlN), beryllium oxide (BeO), and silicon carbide (SiC) can efficiently transfer heat while preventing electrical current flow. This makes them ideal for electronic components, power devices, and high-temperature applications where electrical isolation and reliable heat dissipation are critical.

Additionally, ceramics offer:

  • High thermal stability at elevated temperatures
  • Corrosion resistance in harsh environments
  • Mechanical strength and durability under thermal cycling

Together, these properties allow ceramics to serve as effective heat spreaders, substrates, and insulating heat sinks in industries such as electronics, aerospace, automotive, and energy.

How to decide the application direction of materials?

  • Advanced ceramics with high thermal conductivity are suitable for core parts of thermal management, such as electronic packaging, aerospace thermal control, semiconductor heat plates, etc.
  • Medium thermal conductivity combined with high strength materials are suitable for dynamic high-temperature components, such as high-load mechanical bearings and nozzles.
  • Low thermal conductivity materials are used in insulation and temperature control areas, such as thermal barrier coatings and insulating partitions.

Thermal Conductivity Data of Key Advanced Ceramics

Ceramic Material k (W/m·K) Characteristics
Beryllium Oxide (BeO) 230–330 Very high thermal conductivity, electrical insulation, toxic when powdered
Aluminum Nitride (AlN) 170–210 High thermal conductivity, electrical insulation, low dielectric loss
Silicon Carbide (SiC) 120–200 Extremely hard, excellent corrosion and wear resistance, high thermal conductivity
Boron Nitride (h‑BN) ~60 Lubricating, thermally stable, electrically insulating
Alumina (Al₂O₃) 25–35 High hardness, good wear resistance, excellent electrical insulation
Silicon Nitride (Si₃N₄) 20–30 High fracture toughness, thermal shock resistance, low density
Zirconia (ZrO₂) 2–3 High toughness, low thermal conductivity, phase transformation toughening
Machinable Glass Ceramic (MGC) ~2 Easily machinable, good dielectric strength, low thermal conductivity

*Data is for reference only.

Need Help Choosing the Right Ceramic?

Selecting the right high thermal conductivity ceramic material is critical to ensuring long-term reliability and optimal performance. Whether you need beryllium oxide, aluminum nitride or alumina ceramic sheet materials, our materials offer industry-leading performance, durability and precision.

Our technical team is here to help – contact us today for expert, customized advice based on your specific needs.

Comparison: Ceramics vs Metals and Plastics

The bar chart below shows the thermal conductivity for various engineering materials – from super-hard ceramics to common industrial plastics, ranked from high to low.

Ceramic Metal Plastic

*Data is for reference only.

Applications based on ceramic Thermal Conductivity

  • Application ceramics:

    • Aluminum nitride (AlN)
    • Beryllium oxide (BeO)
    • Silicon nitride (Si₃N₄)

  • Application cases:

    • High heat load bearing insulation gasket: Si₃N₄ ceramic has good thermal conductivity (about 20-30 W/m·K), high temperature resistance and impact resistance, and is used in high-speed spindles to effectively conduct heat and avoid overheating.
    • Motor heat dissipation end cover: AlN has high thermal conductivity (about 170-220 W/m·K) and is often used in high-efficiency motor housings to replace traditional metals to reduce weight and thermal stress.
    • High power equipment heat exchange base: used for power module cooling of CNC machine tools.

  • Application ceramics:

    • Aluminum nitride (AlN)
    • Beryllium oxide (BeO)
    • Aluminum oxide (Al₂O₃)

  • Application cases:

    • High-frequency communication module heat dissipation substrate (AlN/BeO): High thermal conductivity (BeO >250 W/m·K), ensuring that the temperature of the microwave chip is controlled within a safe range, commonly used in 5G and radar modules.
    • LED package heat dissipation base: AlN ceramics have high thermal conductivity and good insulation, and are the mainstream material for high-power LED packaging.
    • IGBT/power semiconductor package substrate: AlN substrate effectively suppresses local overheating of the chip and improves life.

  • Application ceramics:

    • Aluminum nitride (AlN)
    • Silicon nitride (Si₃N₄)
    • Alumina ceramics

  • Application cases:

    • Power battery thermal management ceramic gasket: AlN ceramics are used for battery module spacers to quickly conduct heat and prevent thermal runaway.
    • Electric control system power module substrate: used for the heat dissipation base of SiC MOSFET modules to improve system cooling efficiency.
    • Electric drive system ceramic bearings: Si₃N₄ has good thermal conductivity and electrical insulation properties, and is widely used in motor bearings to reduce energy consumption and temperature rise.

  • Application ceramics:

    • Silicon nitride (Si₃N₄)
    • Aluminum nitride (AlN)
    • Beryllium oxide (BeO)

  • Application cases:

    • Thermal insulation/thermal conductive ceramic components of rocket propulsion systems: such as nozzle bushings and high-speed gas ducts, Si₃N₄ has both heat resistance, thermal conductivity and impact resistance.
    • Satellite electronic component heat dissipation base: Use BeO or AlN for efficient heat dissipation to ensure the stable operating temperature of aerospace electronic modules.
    • Thermal control of high-speed aircraft electronic equipment: AlN ceramics are used to dissipate heat from power components in flight control systems to improve system reliability.

  • Application Ceramics:

    • Silicon Nitride (Si₃N₄)
    • Silicon Carbide (SiC)
    • Alumina Ceramics

  • Application Cases:

    • Steel Molten Temperature Probe Protective Sleeve (Si₃N₄, SiC): With good thermal conductivity and chemical corrosion resistance, it can quickly transmit temperature signals and extend service life.
    • Aluminum Molten Thermal Crucible/Nozzle: Using high thermal conductivity ceramics (such as SiC) can heat evenly and avoid local overheating.
    • Thermocouple Protective Sleeve: The high thermal conductivity ceramic shell responds quickly to temperature changes to ensure the accuracy of smelting temperature control.

Related high thermal conductivity ceramics

Beryllium Oxide Ceramics with High Thermal Conductivity

Beryllium Oxide Ceramics

Aluminum Nitride Ceramics with High Thermal Conductivity

Aluminum Nitride Ceramics

Aluminum Nitride (AlN) Substrate with High Thermal Conductivity

Aluminum Nitride Substrate

Related thermal insulation ceramics

Zirconia ceramics-thermal insulation ceramics

Zirconia Ceramics

Machinable Glass Ceramic-thermal insulation ceramics

Machinable Glass Ceramic

Frequently Asked Questions (FAQ)

Beryllium oxide (BeO) tops oxide ceramics with ~285 W/m·K, approaching copper’s performance while still insulating electrically.

They offer high thermal conductivity and electrical insulation—perfect for heat removal in PCBs, LEDs, power semiconductors.

Metals like copper beat ceramics (~400 vs ~285 W/m·K), but ceramics resist corrosion, are lighter, and do not conduct electricity.

Focus on 2D h-BN laminates, single-crystal SiC (>490 W/m·K), and composites (e.g., AlSiC) tailored for thermal expansion matching and high conductivity.

Thermal conductivity of silicon carbide ceramics

Flexural strength