Comparison of three common ceramic substrates

Ceramic substrates are widely used in various high-performance applications due to their excellent mechanical, thermal, and electrical properties. Among them, aluminum nitride (AlN), 96% alumina (Al₂O₃), and silicon nitride (Si₃N₄) ceramic substrates are the most commonly used materials in electronics, aerospace, and power devices. This article provides a comprehensive comparison of their performance, characteristics, and applications, helping engineers and designers select the right ceramic substrate for their needs.

Ceramic Substrate & Ceramic Sheet

Mechanical Properties Comparison

Ceramic substrates must withstand mechanical stresses in various environments, making flexural strength, hardness, and fracture toughness critical factors.

Property Aluminum Nitride (AlN) 96% Alumina (Al₂O₃) Silicon Nitride (Si₃N₄)
Flexural Strength (MPa) 350 350 800 (Superior)
Hardness (HV) 1150 1600 (Hardest) 1500
Fracture Toughness (MPa·m¹/²) 4.0 3.2 7.0 (Best for impact resistance)
  • Best for Mechanical Strength: Silicon nitride ceramic substrate, due to its superior fracture toughness and flexural strength, making it ideal for high-stress environments.

Thermal Properties Comparison

Thermal conductivity and expansion are crucial for heat dissipation and thermal stability in electronic applications.

Property Aluminum Nitride (AlN) 96% Alumina (Al₂O₃) Silicon Nitride (Si₃N₄)
Thermal Conductivity (W/m·K) 170 (Excellent) 22 25
Thermal Expansion (×10⁻⁶/K) 5.0 7.0 3.0 (Lowest)
Maximum Operating Temperature (℃) 1000 1500(Highest) 1200
  • Best for Heat Dissipation: Aluminum nitride ceramic substrate has the highest thermal conductivity, making it ideal for power electronics and LED applications.

Electrical Properties Comparison

Electrical insulation and dielectric properties affect the performance of circuit boards and semiconductor components.

Property Aluminum Nitride (AlN) 96% Alumina (Al₂O₃) Silicon Nitride (Si₃N₄)
Dielectric Constant 8.8 9.5 8.2
Dielectric Loss (×10⁻³) 2.0 3.0 1.5 (Lowest)
Volume Resistivity (Ω·cm) 10¹³ 10¹⁴ (Best Insulation) 10¹²
  • Best for Electrical Insulation: 96% alumina ceramic substrate provides the highest volume resistivity, making it ideal for high-voltage applications.

Main performance comparison

Below is a comparison chart of the main properties of the three ceramic substrates, which can quickly see the differences in each performance.

Ceramic Materials Comparison

Applications of Ceramic Substrates

Based on their properties, each ceramic substrate excels in different industries:

Aluminum Nitride (AlN) Ceramic Substrate

  • Best for: High-power electronics, LEDs, and thermal management systems

  • Applications: Power modules, semiconductor packaging, microwave circuits

  • Why? High thermal conductivity and good electrical insulation

96% Alumina (Al₂O₃) Ceramic Substrate

  • Best for: General-purpose electronic circuits and insulating materials

  • Applications: PCB substrates, sensor components, insulators

  • Why? Excellent electrical insulation, high chemical resistance

Silicon Nitride (Si₃N₄) Ceramic Substrate

  • Best for: Extreme environments requiring mechanical strength

  • Applications: Aerospace, automotive engine components, high-temperature electronics

  • Why? Superior fracture toughness, high thermal shock resistance

Comparison of main uses of ceramic substrates

Application Areas Aluminum Nitride (AlN) 96% Alumina (Al₂O₃) Silicon Nitride (Si₃N₄)
Power Electronic Modules ⭐⭐⭐⭐⭐ (Excellent, due to high thermal conductivity) ⭐⭐ (Poor thermal conductivity) ⭐⭐⭐⭐ (better, impact-resistant)
LED Packaging Substrates ⭐⭐⭐⭐⭐ (High thermal conductivity) ⭐⭐ (Poor thermal conductivity) ⭐⭐⭐ (good impact resistance)
RF/Microwave Substrates ⭐⭐⭐⭐⭐ (low dielectric loss) ⭐⭐⭐ (General application) ⭐⭐⭐⭐ (High reliability)
IC Packaging Substrates ⭐⭐⭐⭐⭐ (thermal expansion matching silicon) ⭐⭐ (Thermal expansion mismatch) ⭐⭐⭐⭐ (High reliability)
Aerospace ⭐⭐⭐⭐ (High performance application) ⭐⭐⭐ (generally heat resistant) ⭐⭐⭐⭐⭐ (impact resistant, high temperature resistant)
Automotive Electronics ⭐⭐⭐⭐ (high heat dissipation, some applications) ⭐⭐⭐ (low cost, common) ⭐⭐⭐⭐⭐ (impact resistant, high temperature resistant)
Industrial Heating Substrates ⭐⭐⭐⭐ (high temperature resistant) ⭐⭐⭐⭐⭐ (high temperature resistance, low cost) ⭐⭐⭐⭐⭐ (extremely high heat resistance)

Conclusion: Which Ceramic Substrate Should You Choose?

  • For heat dissipation & high-power electronics → Aluminum nitride ceramic substrate

  • For high electrical insulation & general use → 96% alumina ceramic substrate

  • For extreme mechanical stress & harsh environments → Silicon nitride ceramic substrate

By understanding the performance differences among AlN, Al₂O₃, and Si₃N₄ ceramic substrates, engineers and manufacturers can optimize material selection for enhanced performance and longevity.

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