Aluminum Nitride (AlN) Substrate

Aluminum nitride ceramic substrates have high thermal conductivity, low dielectric coefficient and dielectric loss, and excellent mechanical properties, making them one of the most ideal choices for electronic applications. It is widely used in information communications, LED packaging, semiconductors, power modules (IGBT), image sensing, new energy, electronic appliances and other fields.

ALN Substrate Manufacturing Company

Great Ceramic offers aluminum nitride ceramic substrates produced by tape casting. The shape and size can be customized according to customer needs, the surface can also be polished, or various shapes can be customized through laser cutting and other processes, and are suitable for various metallization processes.

Folha de nitreto de alumínio (AlN)

Properties of AlN Ceramic Substrate

Basic properties of ceramic substrates

Artigos Unidade AlN-170 AlN-200 AlN-230
Cor - Cinzento/Bege Cinzento/Bege Cinzento/Bege
Densidade volúmica g/cm³ 3.3 3.3 3.3
Rugosidade da superfície um(Ra) ＜0.8 ＜0.8 ＜0.8
Camber comprimento ‰ ≤3 ≤3 ≤3

Mechanical properties of substrate

Artigos Unidade AlN-170 AlN-200 AlN-230
Resistência à flexão MPa ≥400 ≥350 ≥300
Resistência à fratura MPa-m1/2 3.0 2.6 2.4
Dureza Vickers GPa 11 11 11

Thermal properties of the substrate

Artigos Unidade AlN-170 AlN-200 AlN-230
Condutividade térmica W/m-k(25℃) ≥170 ≥195 ≥225
Coeficiente de expansão térmica ×10-6/k (20℃~800℃) 4~6 4~6 4~6
Resistência ao choque térmico ≥10(800℃) Sem fissuras Sem fissuras Sem fissuras
Capacidade térmica J/(kg-k) 720 720 720

Electrical properties of the substrate

Artigos Unidade AlN-170 AlN-200 AlN-230
Resistência do volume Ω-cm(20℃) ≥1014 ≥1013 ≥1013
Constante dieléctrica 1MHz 9.0 8.7 8.5
Perda dieléctrica 1MHz 4×10-4 4×10-4 4×10-4
Resistência dieléctrica KV/mm ≥15 ≥15 ≥15

Nota: Cada lote pode ser diferente, apenas para referência.

Nota: visualize-o no seu computador.

Aluminum nitride substrate manufacturing workshop

Dimensions Of Ceramic Substrate

Great Ceramic offers a variety of standardized sizes of aluminum nitride (AlN) ceramic to meet customer needs. In addition, we also provide customers with customized services for ceramic substrates, and the size of the substrate can be customized according to customer needs.

Size(mm)
Espessura 50.8×50.8 114.3×114.3 120×120 140×190 254×254 300×300
0.25 √ √ √ - - -
0.38 √ √ √ - - -
0.5 √ √ √ √ - -
0.635 √ √ √ √ √ √
1 √ √ √ √ √ √
1.5 √ √ √ √ √ √
2 √ √ √ √ √ √

Advantages of aluminum nitride ceramic substrates

  1. Conduct strict quality control from raw materials to finished products to ensure uniform quality;
  2. Provide customized processing services, including size adjustment, surface polishing, laser cutting, etc. according to needs;
  3. Widely used in ceramic metallization, such as DPC (direct copper plating method), thin film sputtering method, DBC (direct copper plating method), AMB (active copper brazing method), thick film printing, etc.;
  4. The minimum thickness can reach 0.1 mm.

Conclusão

Aluminum nitride (AlN) ceramic substrates are vital components in modern electronics, offering a unique combination of high thermal conductivity and electrical insulation. Whether you’re looking for an aluminum nitride sheet, substrate, or ceramic material, AlN’s properties make it a top choice for advanced electronic applications.

For more information about our aluminum nitride (AlN) products, including specifications and customization options, please contact us.

Other FAQs:

Aluminum Nitride (AlN) is a nitride of aluminum that exhibits outstanding thermal conductivity and electrical insulation. AlN ceramic is widely used in electronic components where efficient heat dissipation is crucial. Its chemical formula is AlN, and it belongs to the group of III-V nitrides.

The thermal conductivity of aluminum nitride (AlN) is one of its most notable properties, reaching values up to 170-200 W/m·K. This high thermal conductivity makes it an ideal material for substrates in power electronics, where effective heat dissipation is essential for performance and longevity.

Aluminum nitride ceramics are known for their high thermal stability and excellent mechanical properties. AlN ceramic substrates are widely used in semiconductor packaging, LEDs, and microwave devices due to their thermal performance and reliability.

  • Aluminum Nitride Substrate: These substrates are used to support and interconnect electronic components, ensuring that heat is effectively managed and that the device performs optimally.
  • AlN Substrate Applications: AlN substrates are used in various applications, such as power modules, RF components, and sensors, where high thermal conductivity is a priority.

AlN stands for Aluminum Nitride, a material that combines the properties of nitride and aluminum to offer superior thermal management solutions. Nitride aluminum, another term for AlN, highlights the combination of aluminum with nitrogen to produce a ceramic material with unique characteristics, including thermal and electrical performance.

Aluminum nitride sheets are available in various thicknesses and are often used in applications requiring precise thermal management. The aluminum nitride ceramic substrate is a popular choice in electronics due to its excellent thermal conductivity and mechanical properties.

Learn about alumina ceramic substrates

Substrato cerâmico de alumina

Saiba mais sobre o processamento a laser de substratos cerâmicos

Processamento de substratos cerâmicos por laser

Saiba mais sobre a metalização de substratos cerâmicos

Saiba mais sobre a metalização de substratos cerâmicos