Aluminum Nitride (AlN) Substrate

Aluminum nitride ceramic substrates have high thermal conductivity, low dielectric coefficient and dielectric loss, and excellent mechanical properties, making them one of the most ideal choices for electronic applications. It is widely used in information communications, LED packaging, semiconductors, power modules (IGBT), image sensing, new energy, electronic appliances and other fields.

ALN Substrate Manufacturing Company

Great Ceramic offers aluminum nitride ceramic substrates produced by tape casting. The shape and size can be customized according to customer needs, the surface can also be polished, or various shapes can be customized through laser cutting and other processes, and are suitable for various metallization processes.

Poproś o wycenę

Properties of AlN Ceramic Substrate

Basic properties of ceramic substrates

Przedmioty	Jednostka	AlN-170	AlN-200	AlN-230
Kolor	-	Szary/beżowy	Szary/beżowy	Szary/beżowy
Gęstość objętościowa	g/cm³	3.3	3.3	3.3
Chropowatość powierzchni	um(Ra)	＜0.8	＜0.8	＜0.8
Camber	długość ‰	≤3	≤3	≤3

Mechanical properties of substrate

Przedmioty	Jednostka	AlN-170	AlN-200	AlN-230
Wytrzymałość na zginanie	MPa	≥400	≥350	≥300
Wytrzymałość na złamania	MPa-m^1/2	3.0	2.6	2.4
Twardość Vickersa	GPa	11	11	11

Thermal properties of the substrate

Przedmioty	Jednostka	AlN-170	AlN-200	AlN-230
Przewodność cieplna	W/m-k(25℃)	≥170	≥195	≥225
Współczynnik rozszerzalności cieplnej	×10^-6/k (20℃~800℃)	4~6	4~6	4~6
Odporność na szok termiczny	≥10(800℃)	Brak pęknięć	Brak pęknięć	Brak pęknięć
Pojemność cieplna	J/(kg-k)	720	720	720

Electrical properties of the substrate

Przedmioty	Jednostka	AlN-170	AlN-200	AlN-230
Opór objętościowy	Ω-cm(20℃)	≥10¹⁴	≥10¹³	≥10¹³
Stała dielektryczna	1MHz	9.0	8.7	8.5
Strata dielektryczna	1MHz	4×10^-4	4×10^-4	4×10^-4
Wytrzymałość dielektryczna	KV/mm	≥15	≥15	≥15

Uwaga: Każda partia może być inna, wyłącznie w celach informacyjnych.

Uwaga: należy wyświetlić go na komputerze.

Aluminum nitride substrate manufacturing workshop

Dimensions Of Ceramic Substrate

Great Ceramic offers a variety of standardized sizes of aluminum nitride (AlN) ceramic to meet customer needs. In addition, we also provide customers with customized services for ceramic substrates, and the size of the substrate can be customized according to customer needs.

Size(mm)
Grubość	50.8×50.8	114.3×114.3	120×120	140×190	254×254	300×300
0.25	√	√	√	-	-	-
0.38	√	√	√	-	-	-
0.5	√	√	√	√	-	-
0.635	√	√	√	√	√	√
1	√	√	√	√	√	√
1.5	√	√	√	√	√	√
2	√	√	√	√	√	√

Advantages of aluminum nitride ceramic substrates

Conduct strict quality control from raw materials to finished products to ensure uniform quality;
Provide customized processing services, including size adjustment, surface polishing, laser cutting, etc. according to needs;
Widely used in ceramic metallization, such as DPC (direct copper plating method), thin film sputtering method, DBC (direct copper plating method), AMB (active copper brazing method), thick film printing, etc.;
The minimum thickness can reach 0.1 mm.

Wnioski

Aluminum nitride (AlN) ceramic substrates are vital components in modern electronics, offering a unique combination of high thermal conductivity and electrical insulation. Whether you’re looking for an aluminum nitride sheet, substrate, or ceramic material, AlN’s properties make it a top choice for advanced electronic applications.

For more information about our aluminum nitride (AlN) products, including specifications and customization options, please contact us.

Other FAQs:

Czym jest azotek glinu?

Aluminum Nitride (AlN) is a nitride of aluminum that exhibits outstanding thermal conductivity and electrical insulation. AlN ceramic is widely used in electronic components where efficient heat dissipation is crucial. Its chemical formula is AlN, and it belongs to the group of III-V nitrides.

Aluminum Nitride Thermal Conductivity

The thermal conductivity of aluminum nitride (AlN) is one of its most notable properties, reaching values up to 170-200 W/m·K. This high thermal conductivity makes it an ideal material for substrates in power electronics, where effective heat dissipation is essential for performance and longevity.

AlN Ceramic and AlN Substrate

Aluminum nitride ceramics are known for their high thermal stability and excellent mechanical properties. AlN ceramic substrates are widely used in semiconductor packaging, LEDs, and microwave devices due to their thermal performance and reliability.

Aluminum Nitride Substrate: These substrates are used to support and interconnect electronic components, ensuring that heat is effectively managed and that the device performs optimally.
AlN Substrate Applications: AlN substrates are used in various applications, such as power modules, RF components, and sensors, where high thermal conductivity is a priority.

What is AlN and Nitride Aluminum?

AlN stands for Aluminum Nitride, a material that combines the properties of nitride and aluminum to offer superior thermal management solutions. Nitride aluminum, another term for AlN, highlights the combination of aluminum with nitrogen to produce a ceramic material with unique characteristics, including thermal and electrical performance.

Aluminum Nitride Sheet and Ceramic Substrate

Aluminum nitride sheets are available in various thicknesses and are often used in applications requiring precise thermal management. The aluminum nitride ceramic substrate is a popular choice in electronics due to its excellent thermal conductivity and mechanical properties.