고급 세라믹의 열팽창 계수

The thermal expansion coefficient (CTE) is one of the most critical parameters in the design and application of advanced ceramics. It determines how much a material expands or contracts with changes in temperature, which plays a decisive role in multi-material assemblies, high-temperature environments, and precision systems. Advanced ceramics, known for their excellent dimensional stability and low CTE values, are widely used in various industries to meet demanding thermal requirements.

건너뛰기

데이터 | 비교 | 애플리케이션 | 자주 묻는 질문 | 관련

세라믹의 경도: 특성, 비교 및 응용 분야

Why Thermal Expansion Coefficient Matters

The mismatch in thermal expansion between different materials can lead to thermal stress, cracking, or delamination in composite structures. By selecting ceramics with appropriate CTEs, engineers can minimize such risks and improve the reliability and longevity of products.

Benefits of Using Low Thermal Expansion Advanced Ceramics：

Low-CTE ceramics like silicon nitride (Si₃N₄), silicon carbide (SiC), and aluminum nitride (AlN) exhibit minimal expansion or contraction with temperature changes. This ensures:

  • Consistent dimensional accuracy in high-precision applications (e.g., optics, semiconductors).
  • Prevention of warping, deformation, or misalignment during heating and cooling cycles.

A lower expansion coefficient reduces internal stress during rapid temperature fluctuations, minimizing the risk of thermal cracking. This makes materials like Si₃N₄ and SiC ideal for:

  • Heat exchangers
  • Burner nozzles
  • 항공우주 부품
  • Automotive engine parts

When bonding ceramics to metals or other substrates, thermal mismatch is a leading cause of joint failure. Low-CTE ceramics:

  • Reduce interfacial stress in metal-ceramic brazing.
  • Improve long-term sealing and reliability in electronic packages and feedthroughs.
  • Allow better CTE matching with semiconductors (e.g., GaN, Si) in electronics.

In telescopes, laser systems, and metrology equipment, even micron-level expansion can distort optical paths. Low-CTE ceramics:

  • Maintain optical alignment across temperature ranges.
  • Are widely used for mirrors, lens mounts, and support structures in space and defense optics (e.g., SiC in space telescopes).

By reducing thermal fatigue and microcrack propagation, low-CTE ceramics extend the operational life of components in:

  • High-power electronic modules
  • High-speed bearings
  • High-temperature reactors

In ultra-high vacuum or chemically inert systems where thermal stresses can’t be relieved through diffusion or relaxation, low-CTE ceramics help:

  • Prevent structural failure.
  • Maintain tight tolerances in vacuum chambers, X-ray tubes, and ion beam systems.

CTEs Data of Key Advanced Ceramics

세라믹 소재 (×10⁻⁶/K) at 20–300 °C 특성
실리콘 카바이드(SiC) 2.3 매우 단단하고 내식성 및 내마모성이 뛰어나며 열전도율이 높습니다.
질화규소(Si₃N₄) ~3.7 높은 골절 인성, 열충격 저항성, 저밀도
질화 알루미늄(AlN) 4.2~5.6 높은 열 전도성, 전기 절연성, 낮은 유전체 손실
베릴륨 산화물(BeO) ~6 매우 높은 열전도율, 전기 절연성, 분말화 시 유독성
질화 붕소(h-BN) ~7.2 윤활, 열적 안정성, 전기 절연성
알루미나(Al₂O₃) 7.2~7.5 높은 경도, 우수한 내마모성, 우수한 전기 절연성
가공 가능한 유리 세라믹(MGC) 9.3 손쉬운 가공성, 우수한 유전체 강도, 낮은 열 전도성
지르코니아(ZrO₂) ~10 높은 인성, 낮은 열전도율, 상변태 강화

*데이터는 참고용으로만 제공됩니다.

올바른 세라믹을 선택하는 데 도움이 필요하세요?

Selecting the right expansion coefficient ceramic material is critical to ensuring long-term reliability and optimal performance. Whether you need aluminum nitride, silicon nitride or silicon carbide ceramic materials, our materials offer industry-leading performance, durability and precision.

기술팀이 도와드리겠습니다. 지금 바로 문의하여 특정 요구사항에 따른 전문적인 맞춤형 조언을 받으세요.

비교: 세라믹과 금속 및 플라스틱 비교

아래 막대 차트는 초경도 세라믹부터 일반적인 산업용 플라스틱까지 다양한 엔지니어링 소재의 열전도도를 높은 것부터 낮은 것까지 순서대로 보여줍니다.

세라믹
금속
플라스틱

*데이터는 참고용으로만 제공됩니다.

Applications based on ceramic Thermal Expansion Coefficient

  • Challenge:

    In photolithography and wafer processing, even micron-level thermal expansion can lead to misalignment or equipment failure. Metal parts tend to expand significantly with heat.

  • Solution:

    • Silicon Nitride (Si₃N₄) and Aluminum Nitride (AlN) are used as structural or mounting components due to their low CTE (3.2–4.5 ×10⁻⁶/°C), ensuring dimensional stability during rapid thermal cycling.
    • These materials also offer excellent thermal shock resistance and electrical insulation, further enhancing their suitability for semiconductor environments.

  • Challenge:

    Brazing ceramics to metals (e.g., Kovar, molybdenum) requires materials with matched or compatible CTEs to avoid joint cracking during temperature changes.

  • Solution:

    • Alumina (Al₂O₃) with ~7.1 CTE closely matches that of Kovar (~6.5), making it a standard material for hermetic feedthroughs, sensor housings, and electronic packages.
    • For higher strength or toughness, Zirconia (ZrO₂) may be used, but with specialized brazing alloys or interlayers to accommodate its higher expansion (~10.5).

  • Challenge:

    High-brightness LEDs generate significant heat, and the substrate must conduct heat efficiently while maintaining mechanical integrity.

  • Solution:

    • Aluminum Nitride (AlN) offers high thermal conductivity (~170 W/m·K) and a moderate CTE (~4.5), making it ideal as a substrate material.
    • Its thermal expansion is compatible with GaN and other semiconductors, minimizing thermal mismatch-induced failure.

  • Challenge:

    In satellites and space telescopes, optical components experience extreme thermal gradients, which can cause deformation and loss of focus.

  • Solution:

    • Silicon Carbide (SiC) is selected for mirror structures due to its low CTE (~4.0), high stiffness, and light weight.
    • NASA and ESA have employed SiC mirrors in missions like Gaia and Herschel Space Observatory.

  • Challenge:

    In prototype tooling and metrology fixtures, thermal expansion can influence dimensional accuracy.

  • Solution:

    • MGC (Machinable Glass Ceramic) such as fluorphlogopite-based composites offers moderate CTE (~9.0), close to certain metals and glass types.
    • These materials are used where custom shaping, fast delivery, and moderate thermal performance are required.

Important Materials for Thermal Expansion

열전도율이 높은 질화 알루미늄 세라믹

AlN Ceramics

CTE : 4.2–5.6(×10⁻⁶/K)

Silicon Nitride Ceramics-Low Thermal Expansion Coefficient Ceramics

질화규소 세라믹

CTE : ~3.7(×10⁻⁶/K)

Alumina Ceramic - Thermal Expansion Coefficient Ceramics

알루미나 세라믹

CTE : 7.2–7.5(×10⁻⁶/K)

Machinable Ceramics - Thermal Expansion Coefficient Ceramics

MGC

CTE : 9.3(×10⁻⁶/K)

자주 묻는 질문(FAQ)

Ceramics are bonded ionically/covalently within rigid lattice structures; this bonding resists atomic expansion .

Aluminum nitride (AlN), with CTE ~4–5×10⁻⁶/K, closely matches silicon (~2.6), reducing thermal stress in semiconductor manufacturing.

Yes—if matched CTEs are selected (e.g., zirconia ~10 and titanium alloy ~8.6), stress is minimized. Otherwise, bonding methods like brazing or flexible adhesives are necessary.

Yes—Macor (~9.3) offers repeatable performance up to ~1000 °C and is used in lab equipment where thermal cycling occurs.

실리콘 카바이드 세라믹의 열 전도성

굴곡 강도