Wärmeausdehnungskoeffizienten von Hochleistungskeramiken

The thermal expansion coefficient (CTE) is one of the most critical parameters in the design and application of advanced ceramics. It determines how much a material expands or contracts with changes in temperature, which plays a decisive role in multi-material assemblies, high-temperature environments, and precision systems. Advanced ceramics, known for their excellent dimensional stability and low CTE values, are widely used in various industries to meet demanding thermal requirements.

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Härte von Keramiken: Eigenschaften, Vergleich und Anwendungen

Why Thermal Expansion Coefficient Matters

The mismatch in thermal expansion between different materials can lead to thermal stress, cracking, or delamination in composite structures. By selecting ceramics with appropriate CTEs, engineers can minimize such risks and improve the reliability and longevity of products.

Benefits of Using Low Thermal Expansion Advanced Ceramics：

Low-CTE ceramics like silicon nitride (Si₃N₄), silicon carbide (SiC), and aluminum nitride (AlN) exhibit minimal expansion or contraction with temperature changes. This ensures:

  • Consistent dimensional accuracy in high-precision applications (e.g., optics, semiconductors).
  • Prevention of warping, deformation, or misalignment during heating and cooling cycles.

A lower expansion coefficient reduces internal stress during rapid temperature fluctuations, minimizing the risk of thermal cracking. This makes materials like Si₃N₄ and SiC ideal for:

  • Heat exchangers
  • Burner nozzles
  • Komponenten für die Luft- und Raumfahrt
  • Automotive engine parts

When bonding ceramics to metals or other substrates, thermal mismatch is a leading cause of joint failure. Low-CTE ceramics:

  • Reduce interfacial stress in metal-ceramic brazing.
  • Improve long-term sealing and reliability in electronic packages and feedthroughs.
  • Allow better CTE matching with semiconductors (e.g., GaN, Si) in electronics.

In telescopes, laser systems, and metrology equipment, even micron-level expansion can distort optical paths. Low-CTE ceramics:

  • Maintain optical alignment across temperature ranges.
  • Are widely used for mirrors, lens mounts, and support structures in space and defense optics (e.g., SiC in space telescopes).

By reducing thermal fatigue and microcrack propagation, low-CTE ceramics extend the operational life of components in:

  • High-power electronic modules
  • High-speed bearings
  • High-temperature reactors

In ultra-high vacuum or chemically inert systems where thermal stresses can’t be relieved through diffusion or relaxation, low-CTE ceramics help:

  • Prevent structural failure.
  • Maintain tight tolerances in vacuum chambers, X-ray tubes, and ion beam systems.

CTEs Data of Key Advanced Ceramics

Keramisches Material (×10⁻⁶/K) at 20–300 °C Merkmale
Siliziumkarbid (SiC) 2.3 Extrem hart, ausgezeichnete Korrosions- und Verschleißfestigkeit, hohe Wärmeleitfähigkeit
Siliziumnitrid (Si₃N₄) ~3.7 Hohe Bruchzähigkeit, Temperaturwechselbeständigkeit, geringe Dichte
Aluminiumnitrid (AlN) 4.2~5.6 Hohe Wärmeleitfähigkeit, elektrische Isolierung, geringer dielektrischer Verlust
Beryllium-Oxid (BeO) ~6 Sehr hohe Wärmeleitfähigkeit, elektrische Isolierung, giftig in Pulverform
Bornitrid (h-BN) ~7.2 schmierend, thermisch stabil, elektrisch isolierend
Tonerde (Al₂O₃) 7.2~7.5 Hohe Härte, gute Verschleißfestigkeit, hervorragende elektrische Isolierung
Bearbeitbare Glaskeramik (MGC) 9.3 Leicht bearbeitbar, gute Durchschlagfestigkeit, geringe Wärmeleitfähigkeit
Zirkoniumdioxid (ZrO₂) ~10 Hohe Zähigkeit, geringe Wärmeleitfähigkeit, Phasenumwandlungszähigkeit

*Die Daten dienen nur als Referenz.

Brauchen Sie Hilfe bei der Auswahl der richtigen Keramik?

Selecting the right expansion coefficient ceramic material is critical to ensuring long-term reliability and optimal performance. Whether you need aluminum nitride, silicon nitride or silicon carbide ceramic materials, our materials offer industry-leading performance, durability and precision.

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Vergleich: Keramik vs. Metalle und Kunststoffe

The bar chart below shows the thermal expansion coefficients for various engineering materials – from super-hard ceramics to common industrial plastics, ranked from high to low.

Keramik
Metall
Kunststoff

*Die Daten dienen nur als Referenz.

Applications based on ceramic Thermal Expansion Coefficient

  • Challenge:

    In photolithography and wafer processing, even micron-level thermal expansion can lead to misalignment or equipment failure. Metal parts tend to expand significantly with heat.

  • Solution:

    • Silicon Nitride (Si₃N₄) and Aluminum Nitride (AlN) are used as structural or mounting components due to their low CTE (3.2–4.5 ×10⁻⁶/°C), ensuring dimensional stability during rapid thermal cycling.
    • These materials also offer excellent thermal shock resistance and electrical insulation, further enhancing their suitability for semiconductor environments.

  • Challenge:

    Brazing ceramics to metals (e.g., Kovar, molybdenum) requires materials with matched or compatible CTEs to avoid joint cracking during temperature changes.

  • Solution:

    • Alumina (Al₂O₃) with ~7.1 CTE closely matches that of Kovar (~6.5), making it a standard material for hermetic feedthroughs, sensor housings, and electronic packages.
    • For higher strength or toughness, Zirconia (ZrO₂) may be used, but with specialized brazing alloys or interlayers to accommodate its higher expansion (~10.5).

  • Challenge:

    High-brightness LEDs generate significant heat, and the substrate must conduct heat efficiently while maintaining mechanical integrity.

  • Solution:

    • Aluminum Nitride (AlN) offers high thermal conductivity (~170 W/m·K) and a moderate CTE (~4.5), making it ideal as a substrate material.
    • Its thermal expansion is compatible with GaN and other semiconductors, minimizing thermal mismatch-induced failure.

  • Challenge:

    In satellites and space telescopes, optical components experience extreme thermal gradients, which can cause deformation and loss of focus.

  • Solution:

    • Silicon Carbide (SiC) is selected for mirror structures due to its low CTE (~4.0), high stiffness, and light weight.
    • NASA and ESA have employed SiC mirrors in missions like Gaia and Herschel Space Observatory.

  • Challenge:

    In prototype tooling and metrology fixtures, thermal expansion can influence dimensional accuracy.

  • Solution:

    • MGC (Machinable Glass Ceramic) such as fluorphlogopite-based composites offers moderate CTE (~9.0), close to certain metals and glass types.
    • These materials are used where custom shaping, fast delivery, and moderate thermal performance are required.

Important Materials for Thermal Expansion

Aluminiumnitridkeramik mit hoher Wärmeleitfähigkeit

AlN Ceramics

CTE : 4.2–5.6(×10⁻⁶/K)

Silicon Nitride Ceramics-Low Thermal Expansion Coefficient Ceramics

Siliziumnitrid-Keramik

CTE : ~3.7(×10⁻⁶/K)

Alumina Ceramic - Thermal Expansion Coefficient Ceramics

Tonerde-Keramik

CTE : 7.2–7.5(×10⁻⁶/K)

Machinable Ceramics - Thermal Expansion Coefficient Ceramics

MGC

CTE : 9.3(×10⁻⁶/K)

Häufig gestellte Fragen (FAQ)

Ceramics are bonded ionically/covalently within rigid lattice structures; this bonding resists atomic expansion .

Aluminum nitride (AlN), with CTE ~4–5×10⁻⁶/K, closely matches silicon (~2.6), reducing thermal stress in semiconductor manufacturing.

Yes—if matched CTEs are selected (e.g., zirconia ~10 and titanium alloy ~8.6), stress is minimized. Otherwise, bonding methods like brazing or flexible adhesives are necessary.

Yes—Macor (~9.3) offers repeatable performance up to ~1000 °C and is used in lab equipment where thermal cycling occurs.

Wärmeleitfähigkeit von Siliciumcarbid-Keramiken

Biegefestigkeit